A reflow oven is an essential machine used in making electrical circuit boards with the help of Surface Mount technology (SMT). A large reflow oven in the form of a tunnel with a conveyor belt is used for the bulk production of electrical items. Printed circuit boards are passed through this tunnel for reflow soldering of electrical components to the circuit board surface.
Pure nitrogen is the ideal medium used in this reflow oven for its perfect operation. MVS Engineering Pvt. Ltd offers the best gas generator that provides nitrogen for a reflow oven to various manufacturers of electrical devices.
Merits of using nitrogen for Reflow Oven
The use of nitrogen in a reflow oven has many advantages, which are listed below. Many manufacturers of electrical devices prefer to install nitrogen generators of MVS Engineering to avail of these facilities.
● Nitrogen prevents oxidation of heated metals used in electrical circuit boards. Due to its lightness, it rises above oxygen in the air filling up the space where the reflow oven is used for soldering electrical components on the circuit board surface.
● The welding capacity of the reflow oven is highly enhanced by the inertness of nitrogen gas, which prevents undesired chemical reactions between different elements. Thus, even high temperatures cannot adversely affect the soldering process.
● The solderability or the easiness of soldering components to a surface can be improved when it is done in an atmosphere of pure nitrogen. Lesser solder balls are generated while soldering, making the process smoother for the reflow oven.
● The voiding flow rate of the procedure conducted by the reflow oven is decreased by the action of nitrogen. Thus, the fluidity of the soldering agent increases, making the soldering process much faster. It becomes easier for the reflow oven to perform due to this added fluidity.
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Hence, MVS Engineering offers an onsite nitrogen plant that produces large amounts of nitrogen for reflow oven operations. This nitrogen is then pumped into the oven chamber to obtain all the above-mentioned facilities during this process.
